Optical phased arrays

ABSTRACT

An optical phased array formed of a large number of nanophotonic antenna elements can be used to project complex images into the far field. These nanophotonic phased arrays, including the nanophotonic antenna elements and waveguides, can be formed on a single chip of silicon using complementary metal-oxide-semiconductor (CMOS) processes. Directional couplers evanescently couple light from the waveguides to the nanophotonic antenna elements, which emit the light as beams with phases and amplitudes selected so that the emitted beams interfere in the far field to produce the desired pattern. In some cases, each antenna in the phased array may be optically coupled to a corresponding variable delay line, such as a thermo-optically tuned waveguide or a liquid-filled cell, which can be used to vary the phase of the antenna&#39;s output (and the resulting far-field interference pattern).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/279,295, filed Sep. 28, 2016, which in turn is a continuation of U.S.application Ser. No. 14/289,375, now U.S. Pat. No. 9,476,981, which wasfiled on May 28, 2014, and which claims priority, as acontinuation-in-part under 35 U.S.C. § 120, of U.S. application Ser. No.14/149,099, now U.S. Pat. No. 8,988,754, which was filed on Jan. 7,2014, and which in turn claims priority to U.S. Application No.61/749,967, which was filed on Jan. 8, 2013.

BACKGROUND

Electromagnetic phased arrays at radio frequencies are well known andhave enabled applications ranging from communications to radar,broadcasting and astronomy. The ability to generate arbitrary radiationpatterns with large-scale phased arrays has long been pursued. Althoughit is extremely expensive and cumbersome to deploy large-scale radiofrequency phased arrays, optical phased arrays have a unique advantagein that the much shorter optical wavelength holds promise forlarge-scale integration. However, the short optical wavelength alsoimposes stringent requirements on fabrication. As a consequence,although optical phased arrays have been studied with various platformsand recently with chip-scale nanophotonics, the optical phased arraysdemonstrated to date have been one-dimensional arrays or small-scaletwo-dimensional arrays.

SUMMARY

Embodiments of the present invention include an optical phased array forforming a far-field radiation pattern from a coherent optical beamhaving a free-space wavelength λ₀ and corresponding methods of formingfar-field radiation patterns using an optical phased array. One exampleof the optical phased array includes at least one waveguide that isevanescently coupled to a plurality of antenna elements disposed in thesame plane as the waveguide. In operation, the waveguide guides thecoherent optical beam to the antenna elements, which to emit respectiveportions of the coherent optical beam so as to form the far-fieldradiation pattern.

In some cases, the optical phased array comprises a column waveguidethat is evanescently coupled one or more row waveguides. The columnwaveguide guides the coherent optical beam in a first direction to therow waveguides, which guide respective portions of the coherent opticalbeam the antenna elements. For instance, the optical phased array mayinclude a first row waveguide that is evanescently coupled to the columnwaveguide via a first directional coupler with a first couplingefficiency and a second row waveguide that is evanescently coupled tothe column waveguide via a second directional coupler having a secondcoupling efficiency. Depending on the implementation, the first couplingefficiency may be smaller than the second coupling efficiency, e.g., toensure that the amount of optical power coupled into the first rowwaveguide is about equal to the amount of optical power coupled into thesecond row waveguide. If desired, the waveguides can be formed via acomplementary metal-oxide-semiconductor (CMOS) process.

The antenna elements in the optical phased array can be spaced at anyappropriate pitch, including a pitch about equal to an integer multipleof λ₀/2 or a pitch of less than or equal to about λ₀/2. The antennaelements may also emit respective portions of the coherent optical beamthat are of approximately equal amplitude. In some cases, each antennaelement may include a grating that diffracts at least part of thecorresponding portion of the coherent optical beam so as to form thefar-field radiation pattern. Each grating may have a full-width,half-maximum diffraction bandwidth of at least about 100 nm. And eachgrating may be configured to suppress resonant back-reflection of thecorresponding respective portion of the coherent optical beam.

In some cases, the optical phased array may include a plurality ofvariable optical delay lines, each of which is in optical communicationwith a corresponding antenna element. In operation, this variableoptical delay line can be used to shift the phase of a correspondingportion of the coherent optical beam so as to vary an amplitudedistribution of the far-field radiation pattern and/or to compensate forphase error in the at least one waveguide. Each variable optical delayline may be actuated by a corresponding heater, such as a resistiveheater formed in a doped semiconductor. In operation, the heater heatsat least a portion of the variable optical delay line so as to changethe shift in phase imparted on the corresponding portion of the coherentoptical beam by the variable optical delay line. A controller operablycoupled to the heater may control the heater's temperature so as to varythe far-field radiation pattern via a change in the shift in phaseimparted on the corresponding portion of the coherent optical beam bythe variable optical delay line.

In another embodiment, the optical phased array comprises a substrate, acolumn waveguide, a plurality of directional couplers, a plurality ofrow waveguides, a plurality of phase shifters, a plurality of antennaelements, and a plurality of controllable heaters. The column waveguide,directional couplers, row waveguides, phase shifters, and antennaelements are formed in or on the substrate. In operation, the columnwaveguide guides a coherent optical beam having a free-space wavelengthof about λ₀ to the directional couplers, which evanescently couplerespective portions of the coherent optical beam from the columnwaveguide to the row waveguides. The row waveguides guide andevanescently couple portions of these “row beams” to the phase shifters,each of which imparts a corresponding phase shift to a correspondingportion of the corresponding row beam so as to produce a correspondingphase-shifted beam. Each phase shifter couples its correspondingphase-shifted beam to a particular antenna element in the plurality ofantenna elements. The antenna elements emit the phase-shifted beams atan angle with respect to the substrate so as to form the far-fieldradiation pattern. And the controllable heaters heat the phase shiftersso as to vary the phase shifts, which in turn varies the far-fieldradiation pattern and/or compensates for phase errors in the columnwaveguide and/or the row waveguides.

It should be appreciated that all combinations of the foregoing conceptsand additional concepts discussed in greater detail below (provided suchconcepts are not mutually inconsistent) are contemplated as being partof the inventive subject matter disclosed herein. In particular, allcombinations of claimed subject matter appearing at the end of thisdisclosure are contemplated as being part of the inventive subjectmatter disclosed herein. It should also be appreciated that terminologyexplicitly employed herein that also may appear in any disclosureincorporated by reference should be accorded a meaning most consistentwith the particular concepts disclosed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

The skilled artisan will understand that the drawings primarily are forillustrative purposes and are not intended to limit the scope of theinventive subject matter described herein. The drawings are notnecessarily to scale; in some instances, various aspects of theinventive subject matter disclosed herein may be shown exaggerated orenlarged in the drawings to facilitate an understanding of differentfeatures. In the drawings, like reference characters generally refer tolike features (e.g., functionally similar and/or structurally similarelements).

FIG. 1A illustrates a 64×64 element optical phased array (the insetshows a unit cell, or pixel, of the optical phased array).

FIG. 1B shows a power feeding network suitable for use in the opticalphased array of FIG. 1A with a bus waveguide that couples equal amountsof optical power to multiple row waveguides.

FIG. 1C is a plot of the coupler length (left axis) and couplingefficiency (right axis) versus row/column index for the bus-to-rowcouplers (upper curve) and the row-to-unit couplers (middle curve) inthe 64×64 nanophotonic phased array of FIG. 1A.

FIG. 1D shows a unit cell (pixel) of the optical phased array of FIG. 1Awith a directional coupler, phase shifter, and nanophotonic antennaelement.

FIG. 2A is a schematic illustration of an 8×8 element active opticalphased array that uses thermo-optic phase tuning.

FIG. 2B is a schematic illustration of an thermo-optically tuned pixelin the active optical phased array of FIG. 2A.

FIG. 3A is a schematic illustration of a 12×12 element active opticalphased array that uses liquid-based phase tuning.

FIG. 3B is a schematic illustration of an liquid-tuned pixel in theactive optical phased array of FIG. 3A.

FIG. 4A is a plot of a finite-difference time-domain (FDTD) simulationof the three-dimensional, near-field emission of a nanophotonic antennasuitable for use in an optical phased array.

FIG. 4B is a polar plot of the far-field radiation pattern of theoptical nanoantenna, calculated from the near-field emission plotted inFIG. 4A, using the near-to-far-field transformation.

FIG. 4C is a polar plot of a simulated radiation pattern (here, showingthe logo of the Massachusetts Institute of Technology (MIT)) emitted bythe 64×64 element optical phased array shown in FIG. 2A in the farfield.

FIG. 4D is a polar plot of the circled area of the simulated radiationpattern shown in FIG. 4C.

FIG. 5 is a block diagram that illustrates antenna synthesis for alarge-scale nanophotonic phased array.

FIG. 6A shows a simulated far-field array factor pattern—in this case,the “MIT” logo—emitted by a 64×64 optical phased array with a pixelpitch of λ₀/2.

FIG. 6B shows a simulated far-field array factor pattern emitted by a64×64 optical phased array with a pixel pitch of λ₀/2 for multiple beamspropagating at different angles, e.g., for optical free spacecommunications.

FIG. 6C is a color plot of the phase distribution across the 64×64optical phased array used to generate the far-field array factor patternshown in FIG. 6A.

FIG. 6D is a color plot of the phase distribution across the 64×64optical phased array used to generate the far-field array factor patternshown in FIG. 6B.

FIGS. 7A-7D are simulated far-field array factor patterns with differentphase noise levels simulated by adding Gaussian phase noise ε_(mn) withstandard deviations of σ=0 (i.e., no phase noise; FIG. 7A), σ=π/16 (FIG.7B), σ=π/8 (FIG. 7C), and σ=π/4 (FIG. 7D) to the ideal phase φ_(mn).

FIG. 8A is a scanning electron micrograph (SEM) of a fabricated 64×64element optical phased array.

FIG. 8B is an SEM of a pixel in the fabricated 64×64 element opticalphased array shown in FIG. 8A.

FIG. 9A is an SEM of a fabricated nanophotonic antenna suitable for usein an optical phased array.

FIG. 9B is a plot of the simulated emission efficiency versus emissionwavelength for the nanophotonic antenna of FIG. 9A in upward emission(top curve), downward emission (upper middle curve), reflection (lowermiddle curve), and transmission (bottom curve).

FIG. 10A is a diagram of an imaging system used to observe the nearfield and far field of an optical phased array.

FIG. 10B is a near-field image of the optical phased array shown in FIG.8A obtained using the imaging system of FIG. 10A.

FIG. 10C is a close-up view of an 8×8 pixel portion of the near fieldshown in FIG. 10B.

FIG. 10D is a histogram of the measured intensity distribution of theoptical emission from the pixels in the optical phased array.

FIG. 10E is a far-field (Fourier-plane) image of the optical phasedarray shown in FIG. 1B obtained using the imaging system of FIG. 10A.

FIG. 10F is a far-field (Fourier-plane) image of a 32×32 pixel portionof the optical phased array shown in FIG. 8B obtained using the imagingsystem of FIG. 10A.

FIGS. 11A-11E illustrates the phase distributions (top row), simulatedfar-field radiation patterns (middle row), and measured far-fieldradiation patterns (bottom row) of the optical phased array of FIG. 2Aemitting a boresight beam (FIG. 11A), a focused beam steered verticallyby 6° (FIG. 11B), a focused beam steered horizontally by 6° (FIG. 11C),a single beam split vertically into two beams (FIG. 11D), and a singlebeam split horizontally into four beams (FIG. 11E).

FIGS. 12A and 12B illustrate a car with on-chip lidar systems forcollision avoidance and autonomous navigation.

FIG. 13A is a block diagram of a frequency-modulated continuous-wave(FMCW) lidar system.

FIG. 13B is a plot of frequency versus time showing the interferencebetween transmitted and received signals using the FMCW lidar system ofFIG. 13A.

FIG. 13C is a block diagram of a transmitter/receiver in the FMCW lidarsystem of FIG. 13A.

FIG. 13D is a diagram of a grating-based antenna element suitable foruse in the transmitter/receiver of FIG. 13C.

FIGS. 14A-14D are SEM images of an FMCW lidar system, a receiver, aphase shifter, and a grating-based antenna element, respectively.

FIG. 15A shows far field images of steady steering using an exemplaryFMCW lidar system (the white circles show the 0.4 numerical aperture ofthe lens).

FIG. 15B shows far field images of high-speed steering using theexemplary FMCW lidar system of FIG. 15A (again, the white circles showthe 0.4 numerical aperture of the lens).

FIG. 15C is a plot of the normalized frequency response of the phasedarray in the exemplary FMCW lidar system of FIGS. 15A and 15B.

DETAILED DESCRIPTION

Examples of the present technology include a large-scale,two-dimensional optical phased array, also called a nanophotonic phasedarray (NPA), with optical nanoantennas that are densely integrated on asilicon chip within a relatively small footprint. For instance, anexemplary NPA may include 4,096 antenna elements arranged in a 64×64element array in an area of about 576 μm×576 μm. The robust NPA designsdisclosed herein, together with state-of-the-art complementarymetal-oxide-semiconductor technology, allows large-scale NPAs to beimplemented on compact and inexpensive nanophotonic chips.

An NPA, like its radio-frequency (rf) counterparts, comprises an arrayof optical antennas, also known as nanoantennas, nanophotonic antennas,antenna elements, or simply elements. For instance, an NPA may include aset of identical optical antennas arranged in a periodic,two-dimensional array with the elements separated by a distance on theorder of an optical wavelength. In other examples, the array may beaperiodic (e.g., random or sparse) and/or one-dimensional. Each opticalantenna in the array emits light of a specific amplitude and phase.These emissions interfere to form a desired far-field radiation pattern.Varying the amplitudes and/or phases of the beams emitted by the opticalantennas causes the far-field radiation pattern to change.

Because light has a relatively short wavelength (e.g., a wavelength onthe order of one micron), an NPA can include thousands or even millionsof antenna elements in a compact, low-cost chip. By incorporating alarge number of antennas, an NPA can generate a high-resolutionfar-field pattern, including almost arbitrary radiation patterns, whichgives the NPA functionalities beyond conventional beam focusing andsteering. However, the short optical wavelength also presents challengesin realizing coherent outputs from such large-scale NPAs because evennanoscale fluctuations affect the ability to balance the phases andpowers of the optical emission from the thousands of nanoantennas thatare balanced in power and aligned in phase to form a specific far-fieldradiation pattern. As a consequence, the chip-based, two-dimensionalNPAs demonstrated to date have been small-scale implementations with nomore than 16 antenna elements and functionalities constrained tofocusing and steering a single beam.

In contrast, examples of the NPAs disclosed here can include many moreantenna elements and can be fabricated using complementarymetal-oxide-semiconductor (CMOS) processes. In one example, an NPAcomprises 64×64 optical nanoantennas on a silicon chip with all 4,096optical nanoantennas balanced in power and aligned in phase to produce aparticular radiation pattern (e.g., the MIT logo) in the far field. (Inoptics, the far field is typically defined as the region for which theFraunhofer approximation applies, i.e., distances greater than or equalto about L>W²/λ, where W is the size of the aperture and A is thewavelength of the emitted light.) This power balance and phase alignmentmay be fixed to ensure repeatable production of a particular far-fieldradiation pattern. Experimental results show that despite the shortoptical wavelength and corresponding length of the phase elements, thephases of the beams emitted by the antenna elements can be maintained,highlighting the ability to make arbitrary manipulations of the phase ofan optical field within a nanophotonic chip.

In other examples, each antenna element in the array includes acorresponding phase tuner for active phase tuning. Tuning the relativephases of the antenna elements in the NPA makes it possible todynamically steer and/or shape the beam emitted by the NPA. Dynamicphase tuning with large numbers of antenna elements also enablesgeneration of more sophisticated far-field radiation patterns, extendingthe functionalities of phased arrays beyond beam focusing and beamsteering.

The large number of nanoantennas and the embedded phase tunabilityenable NPAs to generate arbitrary far-field radiation patternsdynamically and, in turn, to affect new fields such as communication,LADAR, three-dimensional holography, biological and environmentalsensing, and biomedical sciences. For instance, an exemplary NPA couldbe used in a (low-cost) LIDAR suitable for use in cars, trucks,satellites, robots, etc. The ability to take advantage of CMOSintegration process also promises a bright future for low-cost andcompact NPAs.

Optical Phased Arrays with Evanescently Coupled Buses and Nanoantennas

FIGS. 1A-ID illustrate an optical phased array 100 formed using a CMOSintegration process. As shown in FIG. 1A, the optical phased array 100includes 4,096 unit cells (pixels) 130 arranged in 64 pixel×64 pixelgrid at a pitch of about λ₀/2, where λ₀ is the wavelength of the beam(s)emitted by the optical phased array 100. An optical fiber 102 coupleslight from a laser or other coherent light source (not shown) into acolumn bus waveguide 110, which in turn evanescently couples light into64 row bus waveguides 120-1 through 120-64 (collectively, row buswaveguides 120). Each row bus waveguide 120 in turn evanescently coupleslight into 64 pixels 130, which emit light to form a predeterminedfar-field emission pattern.

In this optical phased array 100, the coupling to the row bus waveguides120 is controlled in such a way that each row bus waveguide 120 obtainsthe same amount of power as described in greater detail below. Theoptical power in each row bus waveguide 120 is then similarly dividedamong the 64 pixels 130 coupled to that row bus waveguide 120 so thatall 4,096 optical nanoantennas in the optical phased array 100 areuniformly excited. Because each pixel 130 receives an equal portion ofthe optical power provided by the optical fiber 102, differences in therelative phases of the beams emitted by the pixels 130 determine theoptical phased array's far-field emission pattern. In other examples,the optical power coupled into and/or out of each pixel 130 may beweighted, attenuated, or amplified to produce a pixel-by-pixel variationin the emitted power to produce a particular far-field radiationpattern.

In this example, the pixel pitch is less than half of the free-spacewavelength, λ₀, of the optical emission in both the x and y directions.Because the pixel pitch is less than λ₀/2, then the optical phased array100 can produce a unique interference pattern in the far field withouthigh-order radiation lobes. For pixel pitches greater than λ₀/2, theoptical phased array 100 may produce (possibly undesired) high-orderinterference patterns in the far field in addition to the desiredfar-field radiation pattern. In other words, the optical phased array100 may produce aliased versions of the desired pattern in the farfield.

Power Management in a Nanophotonic Phased Array

In phased arrays, the amplitudes of the pixels' respective emissionsaffect the far-field radiation pattern. Undesired variations in theseamplitudes may corrupt or otherwise degrade the optical phased array'sfar-field radiation pattern. Preventing undesired amplitude variationsoften becomes more challenging (and more important) in larger arrays.Thus, in large arrays (e.g., arrays with thousands of pixels), the powerfeeding network should deliver optical power reliably and precisely toeach antenna element.

FIG. 1B illustrates the optical phased array's power feeding network—thecolumn bus waveguide 110 and the row bus waveguides 120—in greaterdetail. The column bus waveguide 110 and row bus waveguides 120 may beformed of silicon waveguides (e.g., silicon-on-insulator waveguides) asunderstood in the art of CMOS processing and CMOS electronics. Thecolumn bus waveguide 110 is butt-coupled to the optical fiber 102, whichlaunches an optical beam into a single transverse mode supported by thecolumn bus waveguide 110.

The optical beam propagates along the column bus waveguide 110 through aseries of column-to-row directional couplers 140-1 through 140-64(collectively, directional couplers 140), each of which couples acorresponding portion of the optical beam into a corresponding row buswaveguide 120. The directional couplers 140-1 through 140-64 shown inFIG. 1B are four-port, passive devices formed by respective columncoupling regions 112-1 through 112-64 (collectively, coupling regions112) of the column bus waveguide 110. In each directional coupler 140,the column coupling region 112 runs parallel to and spaced apart from arow coupling region 122-1 through 122-64 (collectively, coupling regions122) in the corresponding row bus waveguide 120-1 through 120-64.

In operation, light propagating through a given column coupling region112-m evanescently couples into the adjacent row coupling region 122-m,where m represents the row number. As understood by those of skill inthe art, the proportion of optical power transferred from the columncoupling region 112-m into the row coupling region 122-m varies as afunction of the coupling regions' optical path lengths, L_(c)(m), andthe optical path length separating the column coupling region 112-m fromthe row coupling region 122-m. To provide equal power to each row, thedirectional couplers' lengths L_(c)(m) are varied to change the couplingratio in such a way that the m^(th) (1<m<M) row bus waveguide has acoupling efficiency of 1/(M+2−m), where M is the highest row number (inthis case, M=64). The desired coupling ratios (and coupler lengths) canbe obtained through a three-dimensional finite-difference time-domainsimulation or any other suitable technique. For the 64 pixel×64 pixeloptical phased array 100 shown in FIG. 1A, the bus-to-row coupler lengthL_(c)(m) varies from about 3.53 μm (a coupling efficiency of about1.54%) for m=1 to about 8.12 μm (a coupling efficiency of about 50%) form=64 in order to distribute power equally among the row bus waveguides120.

In other examples, the power distribution across the optical phasedarray may be non-uniform. For instance, the power distribution may havea Gaussian or exponentially decaying envelope to provide a Gaussian orLorentzian shape to the beams emitted by the optical phase array.Similarly, the directional couplers' coupling ratios can be changed byvarying the separation distance between the coupling regions 112 and 122instead of or in addition to varying the coupler length. The couplingefficiency tends to be less sensitive to variations in coupler lengththan to variations in the separation distance, however, so directionalcouplers 140 with varying lengths tend to have looser fabricationtolerances than directional couplers with varying separation distances.

Some optical phased arrays may also include tuning mechanisms forvarying the power distribution across the array, e.g., to change or scanthe far-field pattern. For instance, each directional coupler mayinclude an interferometer, such as a Mach-Zehnder modulator or ringresonator, with an input port coupled to the column bus waveguide, afirst output port coupled to the column bus waveguide, and a secondoutput port coupled to the row bus waveguide. Tuning the interferometerwith an electric field (e.g., via electrodes) or magnetic field (e.g.,via electro-magnets) changes its coupling ratio, allowing adjustment ofthe optical power coupled from the column bus waveguide into the row buswaveguide.

In other embodiments, one or more of the row bus waveguides may includea variable optical attenuators at or near its optical connection withthe column bus waveguide. Actuating the variable optical attenuatorreduces the optical power propagating through the corresponding row buswaveguide. Alternatively, or in addition, the column bus waveguide mayalso include one or more variable optical attenuators, e.g., distributedbetween the successive directional couplers. Actuating a variableoptical attenuator in the column bus waveguide reduces the optical poweravailable for coupling into the row bus waveguide(s) downstream from thevariable optical attenuator.

FIG. 1C is a plot that illustrates the performance of the power feedingnetwork in the optical phased array 100 of FIGS. 1A-1C. It shows thecoupler length (left axis) and coupling efficiency (right axis) versusrow/column index for the directional couplers that connect the columnbus waveguide 110 to the row bus waveguides 120 and for the row-to-pixeldirectional couplers (described below with respect to FIG. 1D) thatconnect the row bus waveguides 120 to the pixels 130 in the opticalphased array 100 of FIG. 1A. (The lengths of row-to-pixel directionalcouplers are different than those of the column-to-row directionalcouplers 140 because the row-to-pixel directional couplers havedifferent bend radii than the column-to-row directional couplers 140.)

Nanoantenna Design and Phase Management

FIG. 1D shows a pixel 130 in the optical phased array 100 of FIG. 1A ingreater detail. The pixel 130 includes a pixel waveguide 132 that isformed using the same CMOS process used to form the column bus waveguide110 and the row bus waveguides 120. In some cases, all of thesewaveguides may be formed of the same semiconductor material, such assilicon or silicon nitride, on a layer of dielectric cladding, such assilicon oxide (SiO_(x)). Depending on their refractive indices andcross-sectional dimensions, these waveguides may guide light at visiblewavelengths or infrared wavelengths. To guide light at a wavelength of1550 nm, for example, the waveguides may be about 220 nm tall and about400 nm wide.

The pixel waveguide 132 is evanescently coupled to a corresponding rowbus waveguide 120 via a row-to-pixel directional coupler 150. Like thecolumn-to-row directional couplers 140 shown in FIG. 1B, therow-to-pixel directional coupler 150 is formed by a coupling region 124in the row bus waveguide 120 that runs parallel to and spaced apart froma coupling region 134 in the pixel waveguide 138. And like thecolumn-to-row directional couplers 140, the row-to-pixel directionalcoupler 150 has a length (and/or width) that is selected to couple apredetermined percentage of the optical power from the row bus waveguide120 into the pixel waveguide 132. This coupling efficiency may bedifferent for each pixel, e.g., to ensure that each pixel radiatesapproximately the same amount of energy, to provide a predeterminedenvelope to the near-field radiation pattern emitted by the opticalphased array 100, etc. In other embodiments, the row-to-pixeldirectional coupler 150 may include an active device that can be used tovary the amount of optical power coupled into (and out of) the pixel130.

The pixel waveguide 132 couples light into an antenna element 138 (alsoknown as a nanoantenna, nanophotonic antenna, or element) via anS-shaped static optical delay line 136. The static optical delay line136 is formed of a section of the pixel waveguide 132 whose optical pathlength is selected to shift the phase of wave propagating through thepixel waveguide 132 by a predetermined amount φ_(mn). In this case, thestatic optical delay line 136 includes two sections, each of whichinduces a phase shift φ_(mn)/2, where m and n are the pixel's row andcolumn indices, for a total phase shift φ_(mn). In other embodiments,the pixel may include an optical delay line more or fewer segments, eachof which induces an appropriately selected phase shift (e.g., φ_(mn)/4and 3φ_(mn)/4, φ_(mn)/3 and 2φ_(mn)/3, etc.).

As shown in FIG. 1D, using a curved or serpentine delay line 136 reducesthe pixel's size, which in turn allows for a finer pixel pitch. Inaddition, the delay line design makes the position of the antennaelement 138 independent of the phase delay φ_(mn), so that all of theantenna elements 138 can be placed on a periodic grid. The variedcoupler length slightly affects the phases of the transmitted light andthe coupled-out light. This effect can be accounted for when calculatingthe phase shift φ_(mn) for each pixel 130.

The antenna element 138 shown in FIG. 1D is a dielectric grating formedin the same plane as the column bus waveguide 110, the row buswaveguides 120, and the pixel waveguide 132. The grating diffracts lightup and down, out of the plane of the waveguides and the grating. Becausethe grating has a relatively small number (e.g., 5) of rulings, it mayhave a diffraction bandwidth with a full-width half-maximum of hundredsof nanometers (e.g., 100 nm, 200 nm, etc.). In some cases, the gratingmay be blazed to diffract more light up than down (or vice versa). Inaddition, the grating period may be slightly detuned from resonantemission to avoid reflecting radiation back into the pixel waveguide132, where it could be produce undesired interference. This detuning mayshift the optical axis of the emitted beam away from the surface normalof the grating.

Active Optical Phased Arrays

FIGS. 2A and 2B illustrate an 8×8 actively tunable optical phased array200 and a unit cell (pixel) 230, respectively. Like the passive phasedarray 100 shown in FIG. 1A, the active phased array 200 shown in FIG. 2Aincludes a source of optical radiation—in this case, an optical fiber202 coupled to a laser (not shown)—that launches an optical beam with afree-space wavelength λ₀ into a single-mode column bus waveguide 210.Evanescent directional couplers 240-1 through 240-8 (collectively,directional couplers 240) like those described with respect to FIG. 1Bcouple light from the column bus waveguide 210 into eight different rowbus waveguides 220-1 through 220-8 (collectively, row bus waveguides220). And as described above, the directional couplers' couplingefficiencies may vary so as to ensure that each row bus waveguidereceives a predetermined amount (e.g., an equal amount) of optical powerfrom the column bus waveguide 210.

Each row bus waveguide 220 guides an optical beam from the correspondingdirectional coupler 240 to eight unit cells (pixels) 230, each of whichcan be on the order of λ₀ (e.g., about 9 μm×9 μm). As described abovewith respect to FIG. 1D, directional couplers 250 evanescently couplelight from the row bus waveguide 220 to corresponding unit cells 230,each of which includes a silicon waveguide 232 that couples light into agrating-based antenna element 238. This antenna element 238 emits thelight with a desired amplitude and phase to form a pattern in the farfield of the active optical phased array 200.

In this case, however, the active optical phased array 200 includes apixel addressing matrix that can be used to independently vary thephases of the beams emitted by the pixels 230. The pixel addressingmatrix is formed of column control wires 260-1 through 260-8(collectively, column control wires 260) and row control wires 262-1through 262-8 (collectively, row control wires 262). In this example,the column control wires 260 and row control wires 262 are disposed inparallel planes above the pixels 230; in other examples, the controlwires may be routed in planes below the pixels 230 instead.

As shown in FIGS. 2A and 2B, each column control wire 260 runs above acorresponding column of pixels 230 and is electrically coupled to acopper-silicon electrical contact 264 in each of the pixels 230 in thecolumn. Similarly, each row control 262 runs above a corresponding rowof pixels 230 and is electrically coupled to a copper-silicon electricalcontact 268 in each pixel 230 in the row. The electrical contacts 264and 268 in each pixel 230 are electrically coupled to a correspondingintegrated heater 266 formed by doping a portion of the siliconwaveguide 232. Each heater 266 may have a resistance of about 2.5 kW,including the resistance of the contacts 264 and 268.

Applying a voltage to a particular column control wire 260-m and aparticular row control wire 262-n causes a change in the electricalpotential across the integrated heater 266 in the pixel 230-mn at theintersection of the column control wire 260-m and the row control wire262-n. This potential change causes the heater 266 to change temperature(get hotter or colder), leading to a corresponding change in the opticalpath length of the doped portion of the silicon waveguide 232 via thethermo-optic effect. And this change in optical path length induces acorresponding phase shift in the optical beam propagating through thewaveguide 232 to the antenna element 238. In some cases, the heater 266may operate with a thermal efficiency of about 8.5 mW per 7° of phaseshift.

FIGS. 3A and 3B illustrate an active optical phased array 300 that usesliquid-based tuning instead of (or in addition) to integrated heatersfor varying the phases of the beams emitted by the pixels. Again, anoptical fiber 302 coupled to a laser (not shown) launches an opticalbeam with a free-space wavelength λ₀ into a single-mode column buswaveguide 310. Evanescent directional couplers 340 couple light from thecolumn bus waveguide 310 into row bus waveguides 320 with couplingefficiencies selected to ensure that each row bus waveguide 320 receivesa predetermined amount (e.g., an equal amount) of optical power from thecolumn bus waveguide 310. Each row bus waveguide 320 guides an opticalbeam from the corresponding directional coupler 340 to a correspondingset of unit cells (pixels) 330, each of which can be on the order of λ₀(e.g., about 9 μm×9 μm). Directional couplers 350 evanescently couplelight from the row bus waveguide 320 to corresponding unit cells 330,each of which includes a silicon waveguide 332 that couples light into agrating-based antenna element 338 as shown in FIG. 3B. This antennaelement 338 emits the light with a desired amplitude and phase to form apattern in the far field of the active optical phased array 300.

Like the active optical phased array 200 shown in FIG. 2A, the activeoptical phased array 300 shown in FIG. 3A includes column control wires360 and row control wires 362 in parallel planes above the plane of thepixels 330. These column control wires 360 and row control wires 362 areconnected to electrical contacts 374 and 376 in the individual pixels330 as shown in FIG. 3B, much like the control wires shown in FIGS. 2Aand 2B.

The active optical phased array 300 illustrated in FIGS. 3A and 3B alsoincludes an array of fluid reservoirs 379 disposed above the unit cells330. In this cases, there is one liquid reservoir 379 for each pixel330; in other cases, a single reservoir may cover multiple pixels. Eachfluid reservoir 379 holds a corresponding volume of fluid 378, such asan electro-active material or transparent fluid with a refractive indexgreater than that of air (e.g., n=1.5). In this example, the fluidcomprises electro-active liquid crystal material 378 that is transparentat the phased array's emission wavelength λ₀.

Applying a voltage to a particular column control wire 360-m and aparticular row control wire 362-n yields a potential drop across theliquid crystal material 378 and fluid reservoir 379-mn in the pixel330-mn at the intersection of the column control wire 360-m and the rowcontrol wire 362-n. This liquid crystal material 378 aligns itself withthe direction of the applied electric field, causing a change in therefractive index experienced by light propagating from the antennaelement 338 through the liquid crystal material 378. This increase ordecrease in the liquid crystal's refractive index retards or advancesthe phase of the emitted beam.

Alternatively, or in addition, the liquid crystal material may alsorotate the polarization of the emitted beam. In some cases, the emittedbeam may then pass through a fixed polarizer (e.g., a linearlypolarizing film; not shown); if the emitted beam's polarization statedoes not match the polarization state passed by the polarizer, thepolarizer attenuates emitted beam as understood by those skilled in theart. Thus, the emitted beam can be selectively attenuated by actuatingthe liquid crystal material to tune the emitted beam's polarizationstate. In other cases, the polarizer may be omitted, and the liquidcrystal material may modulate the polarization of the emitted beam,e.g., to produce polarization-multiplexed patterns in the far fieldand/or to change the polarization of the far-field pattern.

In other examples, the phased array may include one or more auxiliaryreservoirs that are coupled to the fluid reservoirs via microfluidicchannels and/or microfluidic pumps (not shown). These pumps can be usedto increase or decrease the amount of fluid in a particular fluidreservoir so as to produce a corresponding increase or decrease in theoptical path length experienced by the beam emitted by the antennaelement under the fluid reservoir. In other words, the fluid-filledreservoirs may act as variable optical delay lines for tuning thephase(s) of the emitted beam(s).

As readily appreciated by those of skill in the art, applying anappropriate combination of voltages to the column control wires and rowcontrol wires shown in FIGS. 2A and 3A tunes the phases of the beamsemitted by the pixels in phased array. The voltages may be determined bya processor (not shown) in order to project a particular image orpattern of radiation into the far field of the phased array. Forinstance, applying a voltage ramp via the row electrodes across one faceof the optical phase array causes the beam to point up or down,depending on the slope of the voltage ramp.

Optical Phased Arrays for Arbitrary Pattern Generation

The ability to integrate a large number of pixels in a nanophotonicphased array within a small footprint opens up the possibility of usingthe nanophotonic phased array to generate arbitrary, sophisticatedfar-field radiation patterns. The far-field radiation field E(θ, ϕ) ofthe phased array is calculated as the far field of an individualnanoantenna S(θ, ϕ) multiplied by the array factor F_(a)(θ, ϕ), which isa system factor that is related to the phase of optical emission fromall the pixels:E(θ,ϕ)=S(θ,ϕ)×F _(a)(θ,ϕ)  (1)

In principle, arbitrary radiation patterns can be produced in the farfield with large-scale nanophotonic phased arrays by controlling theemitted phases of all the pixels. Given the short optical wavelength(1.55 μm) and the high refractive index of silicon (n≈3.48), however,slight fabrication imperfections may cause significant phase errors. Asa consequence, a nanophotonic phased array should be resistant to phaseerrors in order to be fabricated reliably and to function properly.

Fortunately, the large-scale nanophotonic phased arrays disclosed hereinare highly tolerant of phase errors (e.g., as described below withrespect to FIGS. 7A-7D). This high phase-error tolerance originates fromthe nanophotonic phased array's nature as a Fourier system, in which thephase noise of the near-field emission averages out in the far fieldthrough interference of optical emissions from all of the pixels. Thishigh phase-error tolerance becomes more effective with more pixels andenables nanophotonic phased arrays to scale up to hundreds, thousands,or millions of pixels.

FIGS. 4A-4D illustrate simulations of an optical phase array like thoseshown in FIGS. 1A, 2A, and 3A. The pixel pitch of the nanophotonic arrayis chosen to be 9 μm in both the x and y directions, as used infabrication, and the free-space wavelength is taken to be about 1.55 μm.Because the pixel pitch is a multiple of the free-space half-wavelength,the interference conditions occur periodically in the far field toproduce higher-order patterns, which appear as replicas of the desiredradiation pattern (an “MIT” logo).

FIG. 4A shows a near-field emission pattern, simulated usingthree-dimensional finite-difference time-domain methods, from a gratingantenna element that emits 51% of the optical power upwards and 30%downwards at a wavelength of 1.55 μm. The emission is not vertical(normal to the surface) because the grating period is slightly detunedfrom the period of a second-order grating that would emit vertically.This detuning suppresses resonant back-reflections that might otherwiseinterfere with the light propagating in the phased array. The emissionfrom the nanoantenna is also broadband, with a full-width bandwidthextending across hundreds of nanometers (e.g., more than 100 nm) inwavelength.

FIGS. 4B-4D show simulated far-field patterns of the optical nanoantennashown in FIG. 4A (FIG. 4B) and arrays of the optical nanoantenna shownin FIG. 4A calculated using the near-to-far-field transformation. Thesefar-field patterns appear as projections of the far-field hemisphere tothe equatorial plane in a polar coordinate system. They are viewed fromthe zenith of the far-field hemisphere, where θ and ϕ are the far-fieldazimuth angle and polar angle, respectively. In each case, the projectedpattern is visible mainly in the vicinity of the zenith due to thedirectional emission of the optical nanoantenna. Varying or assigning aparticular optical phase φ_(mn) of each pixel (where m and n are thepixel's row and column indices, respectively) in the nanophotonic phasedarray makes it possible to project a predetermined radiation patternE(θ, ϕ). The phase φ_(mn) of each pixel can be determined by antennasynthesis, e.g. using the Gerchberg-Saxton algorithm as described belowwith respect to FIG. 5.

FIGS. 4C and 4D show simulations of the radiation pattern of a 64×64nanophotonic phased array designed to generate the MIT logo in the farfield. This radiation pattern is a superposition of the far field of thesystem's array factor (as shown in the background) and that of thenanoantenna (in FIG. 4A). The circle in the center of FIG. 4C indicatesthe viewable region in a microscope lens (e.g., with a numericalaperture of 0.4) as also shown in FIGS. 10E and 10F (described below).FIG. 4D shows a close-up view of the viewable region of the far fielddisplaying the MIT logo. The inset on the lower right shows the MIT logopattern.

Synthesis of a Large-Scale Nanophotonic Phased Array

Nanophotonic phased array synthesis yields a specific far-fieldradiation pattern by assigning the optical phase of each pixel in thephased array. As shown in Equation (1) above, the far-field radiationpattern is the multiplication of the far field of an individualnanoantenna S(θ, ϕ) and that of the array factor F_(a)(θ, ϕ). While thefar field of an individual nanoantenna is fixed, the array factorF_(a)(θ, ϕ) is related to the emitting phase of all the pixels in thearray:

$\begin{matrix}{{F_{a}\left( {\theta,\phi} \right)} = {{\sum\limits_{m = 1}^{M}{\sum\limits_{n = 1}^{N}{w_{mn} \cdot e^{j\; 2{\pi{({{x_{m}u} + {y_{n}v}})}}}}}} = {{\mathcal{F}\left( w_{mn} \right)} = {\mathcal{F}\left( e^{j\;\varphi_{mn}} \right)}}}} & (2)\end{matrix}$where M×N is the size of the array and (X_(m), Y_(n)) describes theposition of each nanoantenna. The emitting amplitude and phase of thenanoantenna are described by |W_(mn)| and φ_(mn), respectively, so thatW_(mn)=|W_(mn) exp(iφ_(mn))|.

In a phased array, the nanoantennas may emit with a desired amplitudepattern, such as the uniform amplitude used here (|W_(mn)|=1), to createan ideal interference condition in the far field for the phase (φ_(mn))interaction to take effect properly. The parameters u=sin(θ)cos(ϕ)/λ₀and ν=sin(θ) sin(ϕ)/λ₀ are related to the far-field coordinates (θ, ϕ),and λ₀ is the optical wavelength in free space. As shown in Equation(2), the array factor F_(a)(θ, ϕ) is a simple discrete Fourier transformof the emitted phase of the array.

FIG. 5 is a block diagram that illustrates an efficient iterativeprocess 500 for finding the optical phase ν_(mn) to generate a givenradiation pattern F_(a)(θ, ϕ) using the Gerchberg-Saxton algorithm. Atthe k^(th) iteration, an approximated array factor F_(a) ^(k) (θ, ϕ),which includes the desired amplitude |F_(a)(θ, ϕ)| and a trial phaseφ^(k)(θ, ϕ), is inversely Fourier-transformed (block 510) to get thecorresponding w^(k) _(mn) of each nanoantenna. The far-field trial phaseφ^(k)(θ, ϕ) can be chosen arbitrarily since it does not necessarilyaffect the final far-field radiation image (block 520). In block 530,the pixel amplitude of w^(k) _(mn) is then set to 1, without changingthe phase, to keep the amplitude of the nanoantennas' emission uniformacross the array. Therefore the updated array factor F_(a)*(θ, ϕ) isobtained through a Fourier transform (block 540) whose phase Φ*^(k)(θ,ϕ) is passed to the (k+1)^(th) iteration as the new trial phaseΦ^(k+1)(θ, ϕ) (block 550). The initial trial phase of the radiationfield is set to Φ¹ (θ, ϕ)=0 or another arbitrary value in the firstiteration. After several iterations, the final array factorF_(a)*^(k)(θ, ϕ) generated by the phase exp(iφ_(mn)) converges to thedesired pattern |F_(a)(θ, ϕ)|.

FIGS. 6A-6D show simulations of a 64×64 nanophotonic phased array with apixel pitch of λ₀/2 that used to produce a pattern in the far field withphases generated using antenna synthesis. FIG. 6A shows the “MIT” logoas projected in the far field, and FIG. 6C shows the corresponding phasedistribution across the face of the array. Similarly, FIG. 6B showsmultiple beams with different angles in the far field, with thecorresponding phase distribution shown in FIG. 6D. As appreciated bythose of skill in the art, projecting multiple beams at different anglescan be useful in optical free space communications.

Phase Noise Analysis of Large-Scale Nanophotonic Phased Array

In a nanophotonic phased array, far-field generation relies on theprecise optical phase φ_(mn) of each nanoantenna. However, due to randomfabrication imperfections, the actual phase at each nanoantenna maydiffers from its desired value φ_(mn). This random error can berepresented as a phase noise ε_(mn) whose impact on the array factorpattern is to be analyzed. Assuming the random phase noise has aGaussian probability distribution with zero mean

∈_(mn)

=0 and standard deviation σ, which is usually the case for noiseintroduced by fabrication. The actual resulting array factor pattern inthe presence of phase noise is again given by Equation (2), with thephaseF _(a) ^(ac)(θ,ϕ)<

(e ^(j∈) ^(mn) ·e ^(jφ) ^(mn) )>=<

(e ^(j∈) ^(mn) )>⊗F _(a) ^(id)(θ,ϕ)   (3)where F_(a) ^(ac)(θ, ϕ) stands for the actual array factor pattern withnoise, F_(a) ^(id)(θ, ϕ) is the ideal array factor pattern, and ⊗ is theconvolution operator. The expectation value (denoted by the anglebrackets) is used here, meaning that the average value is taken for thestochastic variables and functions. The discrete Fourier transform ofphase noise is given by

$\begin{matrix}{< {\mathcal{F}\left( e^{j\;\epsilon_{m\; n}} \right)}>={\sum\limits_{m}\sum\limits_{n}} < e^{j\;\epsilon_{mn}} > {\cdot e^{j{({{x_{m}u} + {y_{n}v}})}}}} & (4)\end{matrix}$And the expectation value in Equation (4) is by definition calculated as

$\begin{matrix}{< e^{j\;\epsilon_{mn}}>={\int_{- \infty}^{+ \infty}{{e^{j\;\epsilon} \cdot \frac{1}{\sqrt{2{\pi\sigma}}}}e^{- \sigma^{2/2}}}}} & (5)\end{matrix}$Substituting Equation (5) into equation (4) and then into equation (3)yieldsF _(a) ^(ac)(θ,ϕ)=e ^(−σ) ² ^(/2) ·F _(a) ^(id)(θ,ϕ)   (6)Equation (6) shows that the shape of the far-field array factor patternis preserved while its amplitude is reduced by a factor of exp(−σ²/2)due to the phase noise.

FIGS. 7A-7D show simulations of the far-field radiation patterns of anoptical phased array affected by different levels of phase noise with astandard deviation U. More specifically, the simulations show Gaussianphase noise at levels of σ=0 (no phase noise; FIG. 7A), σ=π/16 (FIG.7B), σ=π/8 (FIG. 7C), and σ=π/4 (FIG. 7D) added to the outputs of a64×64 nanophotonic phased array whose phases φ_(mn) are set to generatethe MIT logo. These figures show that the shape of the desired patternremains relatively unaffected by increasing phase noise, but that thesignal-to-noise ratio (SNR) drops. The increase in background noisecomes from the emitted beams' inability to completely meet the desiredinterference conditions in the presence of the phase noise. Thesimulation results are consistent with the theoretical analysis inEquation (6).

FIGS. 7A-7D show that even with relatively large phase noise (σ=π/4),the desired pattern is still distinguishable. This shows that the phasedarray exhibits high tolerance to phase errors, which relaxes accuracyrequirements on fabrication, and suggests that a large-scalenanophotonic phased array can be produced reliably and functionproperly. Moreover, this high error tolerance does not depend on thescale of array. In fact, statistical considerations imply that theanalysis above applies more precisely to an array with a larger numberof nanoantennas. As a result, the nanophotonic phased array beyond 64×64to millions of pixels.

Performance of an Exemplary Optical Phased Array

The following example is intended to highlight aspects of the inventivesubject matter without limitation of the claims.

Nanophotonic phased arrays were fabricated in a 300-mm CMOS foundry witha 65-nm technology node, using silicon-on-insulator wafers with a 0.22μm top silicon layer and 2 μm buried oxide. A timed partial silicon etch(0.11 μm) was first performed to make the partly etched grating groove.A full silicon etch was then applied to form the waveguides and gratingnanoantennas. Subsequent n and n+ dopings were implanted for activearrays, followed by standard silicidation to make copper-siliconcontacts. The contacts were connected to on-chip probing pads by twometal layers for thermo-optic tuning. SiO₂ with a total thickness of 3.6μm was used to cover the devices, with a final polishing step to makethe surface planar to avoid additional phase errors due to surfacecorrugation.

FIGS. 8A and 8B are scanning electron micrographs (SEMs) of part of a64×64 nanophotonic phased array fabricated at a CMOS foundry. FIG. 8Ashows several pixels in the nanophotonic phased array, and FIG. 8B is aclose-up of the pixel indicated by the rectangle in FIG. 8A. The pixelsize is 9 μm×9 μm, with a compact silicon dielectric grating as anoptical nanoantenna, where the first groove of the grating is partlyetched to enhance the upward emission. The emitted phase of each pixelcan be adjusted by varying the optical path length of an optical delayline within the pixel.

FIG. 9A is a close up of the silicon dielectric nanoantenna in the pixelof FIG. 8B. The nanoantenna is used as an emitter in each pixel fordirect integration with CMOS process. Lighter regions represent siliconwith a height of 220 nm, darker regions represent the buried oxide (BOX)layer underneath the silicon, and the moderately shaded regionrepresents partially etched silicon with a height of 110 nm. Thenanoantenna measures 3.0 μm×2.8 μm and includes five grating etches. Thefirst grating etch is halfway through the 220 nm-thick silicon layer tocreate an up-down asymmetry in order to emit more power up and out ofthe plane of the phased array. The grating period is 720 nm, which isslightly detuned from the period of a second-order grating (581 nm forSi—SiO₂ gratings at λ₀=1.55 μm). This detuning suppresses resonantback-reflections that could otherwise interfere with propagation of beamwithin the phased array. This detuning also causes the antenna to emitlight along an axis angled with respect to the surface normal of theoptical phased array.

FIG. 9B is a plot of the emitting efficiency of the antenna shown inFIG. 9A. It shows a total emission efficiency of 86% is achieved at awavelength of 1.55 μm with 51% emitting up and 35% emitting down. FIG.9B also shows back-reflections of about only 5% at λ₀=1.55 μm and thatthe 3 dB bandwidth of the emission exceeds 200 nm due to the antenna'sshort grating length. More efficient up-emission can be realized byoptimizing the partial etch depth (the partial etch depth was fixed to110 nm in this case out of consideration for other devices on the samemask), by adding a reflective ground plane underneath the grating toreflect the downward emission, or both.

FIG. 10A is a diagram of an imaging system 1000 used to observe the nearfield and far field of the nanophotonic phased array 1010 shown in FIGS.8A, 8B, and 9A emitting light at a wavelength of 1.55 μm. A first lens1020 alone (numerical aperture 0.40) was used to obtain a near-field(NF) image with an infrared charge-coupled device (IRCCD) 1040, as shownby the outer rays. The far-field (FF) image, or Fourier image, was takenby moving the first lens 1020 down (to position 1020′) so as to form thefar-field image in its back-focal plane (Fourier plane) and inserting asecond lens 1030 to project the far-field image onto the IRCCD 1040, asshown by the inner rays.

FIGS. 10B-10F represent data obtained using the system 1000 of FIG. 10A.The near-field image, which is of the plane of the optical phased array,in FIG. 10B shows uniform emission across all of the 64×64 (4,096)nanoantennas. The input bus waveguide is located on the top left corner,causing some excess scattering noise. The scattering noise does notreflect non-uniformity in the array itself and can readily be addressedwith a larger separation from the fiber input. FIG. 10C is a close-upview of part of the near field, containing 8×8 pixels; it shows a highdegree of uniformity in the amplitudes of the antenna outputs.

FIG. 10D is a histogram representing the measured intensity distributionof the optical emission from the pixels. The statistics show that thestandard deviation(s) (σ) of the emission intensity is 13% of theaverage intensity (μ).

FIG. 10E shows the measured far-field radiation pattern of thefabricated 64×64 nanophotonic phased array. The image reveals that thedesired radiation pattern (in this case, the MIT logo) appears in thefar field. The far-field image is clamped by the finite numericalaperture (0.4) of lens 1020 in FIG. 10A. This is also predicted bysimulations, as shown by the circles in FIGS. 4C and 4D, which show thatemission within a small divergence angle from vertical (surface normalto the nanophotonic phased array chip) can be captured. The intensitynoise in the background of the far-field image comes from the lightscattering caused by fiber-to-waveguide coupling. The scattered light isalso responsible for the concentric fringes in the background, throughthe interference of the scattered light between the top and bottomsurfaces of the silicon-on-insulator wafer. This noise can be reduced byplacing the fiber-waveguide coupler farther from the NPA system toreduce the light scattering captured by the imaging column, and a muchcleaner far-field radiation pattern would be expected.

FIG. 10F shows the far-field radiation pattern of a 32×32 nanophotonicphased array on the same chip as the 64×64 nanophotonic phased array.FIG. 10F shows less noise because the 32×32 nanophotonic phased array isfarther away from the fiber coupling point; however, the far-fieldpattern resolution is lower because the 32×32 nanophotonic phased arraycontains fewer pixels than the 64×64 nanophotonic phased array. Themeasured images agree with the simulations in FIGS. 4C and 4D in termsof the shape of the pattern (MIT logo) and the relative intensity of allinterference orders, highlighting the robustness of the nanophotonicphased array design and the accuracy of the fabrication.

Comparing FIG. 10B with FIG. 10E shows that the near-field image of thenanophotonic phased array contains plain uniform emission everywhere,whereas the far field comprises an image with the MIT logo. Until now,image information has generally been stored and transmitted through theintensity of the pixels; in contrast, this large-scale nanophotonicphased array technology opens up another dimension for imaging: theimage information is now encoded in the optical phase of the pixels,much like a hologram, but generated from a single point. Thisdemonstration, as a static phased array capable of generating trulyarbitrary radiation patterns, has applications in, for example, complexbeam generation and mode matching in optical space-divisionmultiplexing.

FIGS. 11A-11E show the phase distribution (top row), simulated far fieldradiation pattern (middle row), and measured far field radiation pattern(bottom row) for an active 8×8 nanophotonic phased array like the arraysshown in FIGS. 2A and 3A. Phase and intensity scales appear at right. Inthe top row, each dot represents a different antenna element/pixel. Inthe middle and bottom rows, the circle indicates the edge of the lens(numerical aperture=0.4), and the box specifies the area of oneinterference order. (Aliased higher orders appear in the far fieldbecause the antenna pitch is greater than the free-space wavelength.)

In FIG. 11A, the phase distribution across is uniform at 0, so the arrayprojects a uniform beam at boresight (in the center of the dashed box).Applying square-wave phase distributions stepped vertically andhorizontally between 0 and π steers the focused beam by 6° to the edgeof each interference order in the vertical direction (FIG. 11B) and thehorizontal direction (FIG. 11C), respectively. Applying square-wavephase distributions stepped vertically between 0 and π/2 splits the beamvertically into two beams as shown in FIG. 11D. And applying one periodof a horizontally oriented triangle wave that varies between 0 and πsplits a single beam into four beams in the horizontal direction asshown in FIG. 11E.

FIGS. 11A-11E show good agreement between simulation and experiment,which confirms the robustness of the nanophotonic phased array as wellas the accuracy of the fabrication and active thermo-optic phase tuning.The active NPA structure can be extended to larger phased arrays (forexample 64×64, as discussed above) with independent electrical controlof each pixel with the aid of fully CMOS-controlled circuitry to accessall of the pixels electrically, to project dynamic patterns in the farfield with applications including but not limited to communications,three-dimensional holographic displays, laser detection and ranging(LADAR), biomedical imaging, and interferometry.

Unlike other holographic approaches, such as the metasurface antennas,the optical phased arrays disclosed herein allow separate control overthe phase and amplitude of light emission and on-chip, single-pointexcitation of the nanophotonic emitters, enabling arbitrary holograms tobe generated entirely on-chip. Moreover, by guiding light in siliconinstead of using free-space light, active manipulation of the opticalphase can be directly implemented to achieve dynamic far-field patternswith more flexibility and wider applications, by converting the pixelinto a thermally phase-tunable pixel in a CMOS process. For instance, aportion of the silicon light path in each pixel can be lightly dopedwith an n-type implant to form a resistive heater for thermo-optic phasetuning while maintaining a low loss of light propagation. Two narrowsilicon leads with heavy n-doping, providing electrical connections toand thermal isolation from the heater, can be connected to the heater onthe inner side of the adiabatic bends to minimize the loss caused bylight scattering.

Integrated Lidars for Cars, Autonomous Vehicles, Etc.

Laser radar (lidar) systems for the automotive industry are used toensure vehicle safety and to steer autonomous vehicles. Compared toradar (another candidate for ranging in the automotive industry), lidaroffers better lateral resolution at a normal aperture size and a muchwider bandwidth. This large bandwidth makes it possible to avoidinterference between different vehicles. Unfortunately, conventionallidar systems are large, include several moving parts, and are expensiveto manufacture and assemble. And despite the substantial progress inoptical phased arrays, conventional phased arrays can only steer acrossa maximum of ˜28°, whereas, for example some autonomous vehicleapplications may require scan angles exceeding 45°. Thus, conventionallidar systems are typically considered only for extremely high endvehicles.

Embodiments of the present invention include a compact on-chip lidarthat uses beam-steering in optical-phased arrays. Depending on itsphased array, an exemplary lidar system can steer a beam in one or twodimensions at high speed, continuously, or both. Moreover, the phasedarray in an exemplary lidar system may exhibit a large angle between thedifferent optical orders for greater power efficiency, large scanangles, and low crosstalk between different ports. And this lidar canwork with targets up to 100 m away with a resolution of less than ameter in three dimensions. In addition, the lidar can be implemented insilicon photonics, which allows for cheap mass production in siliconfabrication facilities. Thus, examples of this lidar can provide 360°coverage in any vehicle at relatively low cost.

FIG. 12 illustrates a car 1202 equipped with four silicon photonicfrequency-modulated lidar chips 1210—one at each corner—to provide 360°sensing in a plane parallel to the ground. Each silicon photonic lidarchip 1210 is connected to direction control electronics 1220, a pulsedor chirped laser 1230, and output electronics 1240 for processing thereturns. Each chip 1210 may have its own electronics and laser, or thelidar chips 1210 may be connected to common components. In operation,each lidar chip 1210 sweeps a beam over a particular angular range. Atarget, such as a person 1201, reflects or scatters the incident beamback towards the lidar chip 1210, which detects the reflected orscattered radiation to provide an indication of the target's position,size, and orientation with respect to the lidar chip 1210.

FIGS. 13A-13D shows the lidar chip 1210 of FIG. 12 in greater detail.FIG. 13A shows a block diagram of the lidar chip 1210 implemented with afrequency-modulated continuous-wave (FMCW) beam from a chirped laser1230. This beam may be at a wavelength of about 1.5 μm to about 2.0 μm.In operation, the FMCW beam propagates from the chirped laser 1230 to apower divider 1211, which sends a first portion of the FMCW beam to atransmit steering unit 1214 a and a second portion to a mixer 1215. Thesteering unit 1214 a controls a transmit antenna 1212 a according tosignals from the steering control 1220 so as to transmit the FMCW beamtowards the target 1201. In certain cases, the lidar chip 1210 mayinclude more than one transmit antenna 1212 a, e.g., arrayed in twodimensions to provide two-dimensional steering.

The target 1201 reflects or scatters at least a portion of the FMCW beamtowards a receive antenna 1212 b whose receptivity pattern is steeredusing another steering unit 1214 b, which is also controlled by thesteering control 1220. In certain cases, the lidar chip 1210 may includemore than one receive antenna 1212 b, e.g., to increase thesignal-to-noise ratio (SNR), to detect beams at different polarizations,etc. The mixer 1215 mixes the received beam with the FMCW beam from thechirped laser 1230 at an on-chip Germanium (Ge) detector 1216, which iscoupled to a radio-frequency (rf) spectrum analyzer 1240 via adirect-current (DC) block (e.g., a high-pass filter or bias tee).

As shown in FIG. 13B, the return signal is a time-delayed version of thetransmitted signal. And as understood in the art, the return signalinterferes with the FMCW beam at the detector 1216 to produce an rf toneat a frequency Δf proportional to the target's distance from the lidarchip 1210. The return may also be Doppler shifted by a frequencyproportional to the target's velocity relative to the lidar chip 1210.

FIG. 13C shows the architecture for the transmit antenna 1212 a andreturn antenna 1212 b. As understood in the art, the antennas 1212 mayhave similar or identical structures; for instance, the antenna elementsmay be at the same pitch or at different pitches to reduce interferencebetween beams. Each antenna 1212 includes a tapped delay line 1250,shown as a plurality of cascaded phase shifters, whose outputs areevanescently coupled to respective correction phase shifters 1254 viarespective evanescent couplers 1252 like those shown in FIGS. 1A, 1B,and 1D. The correction phase shifters 1254 are connected in turn torespective antenna elements 1256, which may be implemented as Si₃N₄gratings as shown in FIG. 13D.

In this case, the phase shifter shown in FIG. 13C are thermo-opticallytuned elements like those shown in FIGS. 2A and 2B. Integratedthermo-optic phase shifters provide the high-speed steering in a smallfootprint and with low power consumption. The phase shifters in thetapped delay line 1250 are controlled by one or more steering signalcontrol lines 1222 and a ground line 1226 that tune the antenna'semission/receptivity pattern by heating the optical waveguide toincrease the optical path length (refractive index). Similarly, one ormore phase-correction control lines 1224 and a ground line 1226 providephase-correction signals to the phase-correction phase shifters 1252.

FIGS. 14A-14D show scanning electron microscope (SEM) images of atransmit and receive antenna, phase shifter, and antenna elementfabricated in a 300 nm CMOS process, e.g., in a substrate comprisingsilicon, silicon oxide, silicon dioxide, Si₃N₄, and/or Ge. The cascadedphase shifting architecture (FIG. 14B) enables a steering frequencyequal to the phase shifter cutoff and further reduces power consumption.This phased array is steerable over the whole 51° beam spacing with a10.6 V steering signal, an average power consumption of about 13mW/antenna, and a 3 dB cutoff steering speed of 100 kHz.

The relation between the beam spacing Θ and unit cell size d is given bysin(Θ)=V/d, where λ is the laser wavelength. Each antenna includessixteen 32 μm long, grating-based antenna elements (FIG. 14D) with a 2μm pitch, which together form a 32 μm×32 μm aperture with a 51° beamspacing in the lateral dimension and no additional beams in thelongitudinal dimension. The grating strength was modified along eachantenna element in order to create a constant intensity across the arraylength.

Phase shifting was achieved using the thermo-optic effect in silicon asexplained above with respect to FIGS. 2A and 2B. The use of an S-shapedwaveguide (FIG. 14C) allowed both a longer phase-shifter length in asmall space and electrical contact to be made to the inner side of thecurves with minimal losses through the use of an adiabatic bend. Anoptical path of length about 1.5 μm, average width of about 0.75 μm andthickness of 0.22 μm, lightly doped at a level 1.5×10¹⁸ cm⁻³, yields atotal resistance of about 8 KΩ per curve. The two curves, connected inparallel, in each phase-shifter create heating of around 500° C. andchange the Si refractive index by about 3.2 percent. Comsol™ simulationsshow that this temperature shift applies not only to the resistor area,but flows quickly along the waveguide, thus enabling higher and moreefficient phase shifting.

FIG. 15A shows the resulting far field beam, captured with an InGaAscamera, as it is steered over the whole beam spacing. The images weretaken through a lens with a numerical aperture of about 0.45 (indicatedby the white circles). This lens shows an angular radius of only 240and, therefore, shows one beam at a time. However, it can still clearlybe seen that at 11 V the next order shows up where the main beam was at0 V bias.

Measurements at frequencies higher than the inverse integration timeused to capture these images show the system's frequency response. Thissetting shows the steering as a steady line (FIG. 15B), where thesteering amplitude is the line length. Comparing the steering angle athigh frequency with the steering angle at low frequency yields thearray's normalized frequency response (FIG. 15C). This test was run witha sinusoidal signal, and showed the 3 dB cutoff operation speed to beabout 100 kHz.

CONCLUSION

While various inventive embodiments have been described and illustratedherein, those of ordinary skill in the art will readily envision avariety of other means and/or structures for performing the functionand/or obtaining the results and/or one or more of the advantagesdescribed herein, and each of such variations and/or modifications isdeemed to be within the scope of the inventive embodiments describedherein. More generally, those skilled in the art will readily appreciatethat all parameters, dimensions, materials, and configurations describedherein are meant to be exemplary and that the actual parameters,dimensions, materials, and/or configurations will depend upon thespecific application or applications for which the inventive teachingsis/are used. Those skilled in the art will recognize, or be able toascertain using no more than routine experimentation, many equivalentsto the specific inventive embodiments described herein. It is,therefore, to be understood that the foregoing embodiments are presentedby way of example only and that, within the scope of the appended claimsand equivalents thereto, inventive embodiments may be practicedotherwise than as specifically described and claimed. Inventiveembodiments of the present disclosure are directed to each individualfeature, system, article, material, kit, and/or method described herein.In addition, any combination of two or more such features, systems,articles, materials, kits, and/or methods, if such features, systems,articles, materials, kits, and/or methods are not mutually inconsistent,is included within the inventive scope of the present disclosure.

The above-described embodiments can be implemented in any of numerousways. For example, embodiments of designing and making the couplingstructures and diffractive optical elements disclosed herein may beimplemented using hardware, software or a combination thereof. Whenimplemented in software, the software code can be executed on anysuitable processor or collection of processors, whether provided in asingle computer or distributed among multiple computers.

Further, it should be appreciated that a computer may be embodied in anyof a number of forms, such as a rack-mounted computer, a desktopcomputer, a laptop computer, or a tablet computer. Additionally, acomputer may be embedded in a device not generally regarded as acomputer but with suitable processing capabilities, including a PersonalDigital Assistant (PDA), a smart phone or any other suitable portable orfixed electronic device.

Also, a computer may have one or more input and output devices. Thesedevices can be used, among other things, to present a user interface.Examples of output devices that can be used to provide a user interfaceinclude printers or display screens for visual presentation of outputand speakers or other sound generating devices for audible presentationof output. Examples of input devices that can be used for a userinterface include keyboards, and pointing devices, such as mice, touchpads, and digitizing tablets. As another example, a computer may receiveinput information through speech recognition or in other audible format.

Such computers may be interconnected by one or more networks in anysuitable form, including a local area network or a wide area network,such as an enterprise network, and intelligent network (IN) or theInternet. Such networks may be based on any suitable technology and mayoperate according to any suitable protocol and may include wirelessnetworks, wired networks or fiber optic networks.

The various methods or processes (e.g., of designing and making thecoupling structures and diffractive optical elements disclosed above)outlined herein may be coded as software that is executable on one ormore processors that employ any one of a variety of operating systems orplatforms. Additionally, such software may be written using any of anumber of suitable programming languages and/or programming or scriptingtools, and also may be compiled as executable machine language code orintermediate code that is executed on a framework or virtual machine.

In this respect, various inventive concepts may be embodied as acomputer readable storage medium (or multiple computer readable storagemedia) (e.g., a computer memory, one or more floppy discs, compactdiscs, optical discs, magnetic tapes, flash memories, circuitconfigurations in Field Programmable Gate Arrays or other semiconductordevices, or other non-transitory medium or tangible computer storagemedium) encoded with one or more programs that, when executed on one ormore computers or other processors, perform methods that implement thevarious embodiments of the invention discussed above. The computerreadable medium or media can be transportable, such that the program orprograms stored thereon can be loaded onto one or more differentcomputers or other processors to implement various aspects of thepresent invention as discussed above.

The terms “program” or “software” are used herein in a generic sense torefer to any type of computer code or set of computer-executableinstructions that can be employed to program a computer or otherprocessor to implement various aspects of embodiments as discussedabove. Additionally, it should be appreciated that according to oneaspect, one or more computer programs that when executed perform methodsof the present invention need not reside on a single computer orprocessor, but may be distributed in a modular fashion amongst a numberof different computers or processors to implement various aspects of thepresent invention.

Computer-executable instructions may be in many forms, such as programmodules, executed by one or more computers or other devices. Generally,program modules include routines, programs, objects, components, datastructures, etc. that perform particular tasks or implement particularabstract data types. Typically the functionality of the program modulesmay be combined or distributed as desired in various embodiments.

Also, data structures may be stored in computer-readable media in anysuitable form. For simplicity of illustration, data structures may beshown to have fields that are related through location in the datastructure. Such relationships may likewise be achieved by assigningstorage for the fields with locations in a computer-readable medium thatconvey relationship between the fields. However, any suitable mechanismmay be used to establish a relationship between information in fields ofa data structure, including through the use of pointers, tags or othermechanisms that establish relationship between data elements.

Also, various inventive concepts may be embodied as one or more methods,of which an example has been provided. The acts performed as part of themethod may be ordered in any suitable way. Accordingly, embodiments maybe constructed in which acts are performed in an order different thanillustrated, which may include performing some acts simultaneously, eventhough shown as sequential acts in illustrative embodiments.

All definitions, as defined and used herein, should be understood tocontrol over dictionary definitions, definitions in documentsincorporated by reference, and/or ordinary meanings of the definedterms.

The indefinite articles “a” and “an,” as used herein in thespecification and in the claims, unless clearly indicated to thecontrary, should be understood to mean “at least one.”

The phrase “and/or,” as used herein in the specification and in theclaims, should be understood to mean “either or both” of the elements soconjoined, i.e., elements that are conjunctively present in some casesand disjunctively present in other cases. Multiple elements listed with“and/or” should be construed in the same fashion, i.e., “one or more” ofthe elements so conjoined. Other elements may optionally be presentother than the elements specifically identified by the “and/or” clause,whether related or unrelated to those elements specifically identified.Thus, as a non-limiting example, a reference to “A and/or B”, when usedin conjunction with open-ended language such as “comprising” can refer,in one embodiment, to A only (optionally including elements other thanB); in another embodiment, to B only (optionally including elementsother than A); in yet another embodiment, to both A and B (optionallyincluding other elements); etc.

As used herein in the specification and in the claims, “or” should beunderstood to have the same meaning as “and/or” as defined above. Forexample, when separating items in a list, “or” or “and/or” shall beinterpreted as being inclusive, i.e., the inclusion of at least one, butalso including more than one, of a number or list of elements, and,optionally, additional unlisted items. Only terms clearly indicated tothe contrary, such as “only one of” or “exactly one of,” or, when usedin the claims, “consisting of,” will refer to the inclusion of exactlyone element of a number or list of elements. In general, the term “or”as used herein shall only be interpreted as indicating exclusivealternatives (i.e. “one or the other but not both”) when preceded byterms of exclusivity, such as “either,” “one of,” “only one of,” or“exactly one of.” “Consisting essentially of,” when used in the claims,shall have its ordinary meaning as used in the field of patent law.

As used herein in the specification and in the claims, the phrase “atleast one,” in reference to a list of one or more elements, should beunderstood to mean at least one element selected from any one or more ofthe elements in the list of elements, but not necessarily including atleast one of each and every element specifically listed within the listof elements and not excluding any combinations of elements in the listof elements. This definition also allows that elements may optionally bepresent other than the elements specifically identified within the listof elements to which the phrase “at least one” refers, whether relatedor unrelated to those elements specifically identified. Thus, as anon-limiting example, “at least one of A and B” (or, equivalently, “atleast one of A or B,” or, equivalently “at least one of A and/or B”) canrefer, in one embodiment, to at least one, optionally including morethan one, A, with no B present (and optionally including elements otherthan B); in another embodiment, to at least one, optionally includingmore than one, B, with no A present (and optionally including elementsother than A); in yet another embodiment, to at least one, optionallyincluding more than one, A, and at least one, optionally including morethan one, B (and optionally including other elements); etc.

In the claims, as well as in the specification above, all transitionalphrases such as “comprising,” “including,” “carrying,” “having,”“containing,” “involving,” “holding,” “composed of,” and the like are tobe understood to be open-ended, i.e., to mean including but not limitedto. Only the transitional phrases “consisting of” and “consistingessentially of” shall be closed or semi-closed transitional phrases,respectively, as set forth in the United States Patent Office Manual ofPatent Examining Procedures, Section 2111.03.

The invention claimed is:
 1. A lidar system comprising: a photonic chip;a power divider, disposed on the photonic chip, to divide a laser beaminto a first portion and a second portion; a transmit antenna array,disposed on the photonic chip in optical communication with the powerdivider, to transmit the first portion of the laser beam toward thetarget; a receive antenna array, disposed on the photonic chip, toreceive a return signal from the target; and a detector, disposed on thephotonic chip in optical communication with the power divider and thereceive antenna array, to detect interference between the return signalwith the second portion of the laser beam.
 2. The lidar system of claim1, wherein the photonic chip comprises a substrate comprising silicon,silicon oxide, silicon dioxide, Si₃N₄, and/or Ge.
 3. The lidar system ofclaim 2, wherein the transmit antenna array and the receive antennaarray are fabricated in the substrate with a semiconductor fabricationprocess.
 4. The lidar system of claim 1, wherein the transmit antennaarray comprises: a plurality of beam splitters to divide the firstportion of the laser beam; and an array of antenna elements, in opticalcommunication with the plurality of beam splitters, to couple outputs ofthe plurality of beam splitters out of the photonic chip.
 5. The lidarsystem of claim 4, further comprising: an array of phase shifters, inoptical communication with the plurality of beam splitters, to tune anemission pattern of the transmit antenna array.
 6. The lidar system ofclaim 1, wherein the receive antenna array comprises: an array ofantenna elements; and a plurality of beam splitters, in opticalcommunication with the array of antenna elements, to combine outputs ofthe array of antenna elements.
 7. The lidar system of claim 6, furthercomprising: an array of phase shifters, in optical communication withthe plurality of beam splitters, to tune a receptivity pattern of thereceive antenna array.
 8. The lidar system of claim 1, furthercomprising: a laser, in optical communication with the power divider, toprovide the laser beam.
 9. The lidar system of claim 8, wherein thelaser is a chirped laser and the laser beam is a frequency-modulatedcontinuous-wave (FMCW) laser beam.
 10. A method of detecting a target,the method comprising: dividing a laser beam into a first portion and asecond portion with a power divider disposed on a photonic chip;transmitting the first portion of the laser beam toward the target witha transmit antenna array disposed on the photonic chip in opticalcommunication with the transmit steering unit, to transmit; receiving areturn signal from the target with a receive antenna array disposed onthe photonic chip; and detecting interference between the return signaland the second portion of the laser beam with a detector disposed on thephotonic chip in optical communication with the power divider and thereceive antenna array.
 11. The method of claim 10, wherein the photonicchip comprises a substrate comprising silicon, silicon oxide, silicondioxide, Si₃N₄, and/or Ge.
 12. The method of claim 11, wherein thetransmit antenna array and the receive antenna array are fabricated inthe substrate with a semiconductor fabrication process.
 13. The methodof claim 10, transmitting the first portion of the laser beam toward thetarget comprises: dividing the first portion of the laser beam with aplurality of beam splitters; and coupling outputs of the plurality ofbeam splitters out of the photonic chip with an array of antennaelements.
 14. The method of claim 13, further comprising: tuning anemission pattern of the transmit antenna array with an array of phaseshifters in optical communication with the plurality of beam splitters.15. The method of claim 10, wherein receiving the return signal from thetarget comprises: combining outputs of an array of antenna elements witha plurality of beam splitters.
 16. The method of claim 15, furthercomprising: tuning a receptivity pattern of the receive antenna arraywith an array of phase shifters in optical communication with theplurality of beam splitters.
 17. The method of claim 10, furthercomprising: coupling the laser beam from a laser into the power divider.18. The method of claim 17, wherein the laser is a chirped laser and thelaser beam is a frequency-modulated continuous-wave (FMCW) laser beam.19. A coherent lidar system comprising: a laser to emit a chirped laserbeam; a power divider, integrated in a photonic chip in opticalcommunication with the laser, to divide the chirped laser beam into afirst portion and a second portion; a transmit antenna array, integratedin the photonic chip in optical communication with the power divider, toilluminate a target with the first portion of the chirped laser beam; atransmit steering unit, operably coupled to the transmit antenna array,to steer the first portion of the chirped laser beam with respect to thetarget; a receive antenna array, integrated in the photonic chip, toreceive a return from the target in response to illumination of thetarget with the first portion of the chirped laser beam; a receivesteering unit, operably coupled to the receive antenna array, to steer areceptivity pattern of the receive antenna array with respect to thetarget; and a detector, disposed on the photonic chip in opticalcommunication with the power divider and the receive antenna array, todetect interference between the return and the second portion of thelaser beam.
 20. The coherent lidar system of claim 19, wherein thetransmit antenna array is a first transmit antenna array configured tosteer the first portion of the chirped laser beam in a first direction,and further comprising: a second transmit antenna array, integrated inthe photonic chip and operably coupled to the first transmit antennaarray, to steer the first portion of the chirped laser beam in a seconddirection.